Disassemble with a tin cleaner

The tin suction device is a maintenance tool that uses manual or electric means to generate suction force and suck the solder away from the copper foil of the circuit board. The tin suction device is shown in the figure below. The lower tin suction device in the figure has a heating function, also known as a tin suction electric soldering iron.

The operation of disassembling the integrated circuit by using the tin absorber is shown in the following figure. The specific process is as follows: press the piston of the tin absorber down until it is stuck. Heat the solder joints with an electric soldering iron until the solder melts. Remove the electric soldering iron, and at the same time quickly attach the nozzle of the tin absorber to the solder joint, and press the button of the tin absorber to allow the suction force generated by the piston to bounce the solder into the tin absorber. If the suction is not clean once, the operation can be repeated multiple times. When the solder of all pins is sucked away, the integrated circuit can be removed from the circuit board.

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Use a brush to disassemble the soldering iron

This disassembly method is relatively simple, and only one electric soldering iron and a small brush are needed for disassembly. When using this method to dismantle the integrated block, first use an electric soldering iron to heat the solder at the pin of the integrated circuit. After the solder on the pin melts, immediately sweep away the molten solder with a brush, and then use this method to remove other After the solder of all the pins is removed, use tweezers or a small flat-blade screwdriver to pry off the integrated circuit.

Use multiple strands of copper wire to remove tin. When using this method for disassembly, multiple strands of copper core wire are required.

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